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BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9

Product Descriptions

Specifications

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Product Descriptions

BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
  • Made by high quality metal material

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9

Specifications

BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9

Item No.:  090602552A
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